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Technical Roadmap

Feature
2013
2014
2015
Standard
Advanced
Materials Arlon, Taconic, Isola, Panosonic, Rogers, ITEQ, 3M, Omega, Dupont, ,RTG5880,etc Arlon, Taconic, Isola, Panosonic, Rogers, ITEQ, 3M, Omega, Dupont, ,RTG5880,etc Arlon, Taconic, Isola, Panosonic, Rogers, ITEQ, 3M, Omega, Dupont, ,RTG5880,etc Arlon, Taconic, Isola, Panosonic, Rogers, ITEQ, 3M, Omega, Dupont, ,RTG5880,etc
Minimum dielectric thickness 0.1mm 0.05mm 0.05mm 0.05mm
Layer count 2-26 2-40 2-46 2-50
HDI / Buried - blind via Mechanical B/B via Mechanical B/B via Mechanical B/B via Mechanical B/B via
Copper filled BVH (Y/N) N N N N
Copper filled PTH (Y/N) N N N N
Capped via (Y/N) Y Y Y Y
LDI (Y/N) N N N N
Maximum board size (mm) 20*24inch 22*52inch 20*30inch 20*35inch
Minimum board thickness (mm) 0.3mm 0.2mm 0.2mm 0.2mm
Maximum board thickness (mm) 5.0mm 10.0mm 6.0mm 6.0mm
Minimum track / gap IL (mil) 3.5mil(1/2oz) 3mil 2mil 2mil
Minimum track / gap OL (mil) 4.0mil(1/2oz) 3mil 3mil 2mil
Surface finish HAL, HASL LF, ENIG, Imm Silver,
Imm Sn, OSP, Gold plating,
ENIG+Gold finger,L/F HASL
+Gold finger
HAL, HASL LF, ENIG, Imm Silver,
Imm Sn, OSP, Gold plating,
ENIG+Gold finger,L/F HASL
+Gold finger
HAL, HASL LF, ENIG, Imm Silver,
Imm Sn, OSP, Gold plating,
ENIG+Gold finger,L/F HASL
+Gold finger
HAL, HASL LF, ENIG, Imm Silver,
Imm Sn, OSP, Gold plating
,ENIG+Gold finger,L/F HASL
+Gold finger
Layer to layer registration 2mil 1.5mil 1.5mil 1.5mil
Minimum hole (mech) (mm/mil) 0.2mm 0.2mm 0.15mm 0.15mm
Minimum hole (laser) (mm/mil) 0.1mm 0.1mm 0.1mm 0.1mm
Aspect ratio PTH 12:1 14:1 16:1 16:1
Aspect ration BVH 0.5:1 0.5:1 0.5:1 0.5:1
Finish hole tolerance (PTH) +/-3mil +/-3mil +/-3mil +/-3mil
Finish hole tolerance (NPTH) +/-2mil +/-2mil +/-2mil +/-2mil
Maximum Cu weight OL 6oz 10oz 6oz 6oz
Maximum Cu weight IL 4oz 6oz 4oz 4oz
Controlled impedance (+/- X%) 10% 5% 10% 10%
Capacity (SQM / month) 6000 6000 8000 10000
Rigid-flex (Y/N) Y Y Y Y
Flexible (Y/N) Y Y Y Y
IMS (Y/N) Y (Al metel substrate) Y (Al, copper metel substrate) Y (Al, copper metel substrate) Y (Al, copper metel substrate)
Embedded components (Y/N) Y N/A Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y Y Y