Technical Roadmap
| Feature |
2013
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2014
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2015
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Standard
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Advanced
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| Materials | Arlon, Taconic, Isola, Panosonic, Rogers, ITEQ, 3M, Omega, Dupont, ,RTG5880,etc | Arlon, Taconic, Isola, Panosonic, Rogers, ITEQ, 3M, Omega, Dupont, ,RTG5880,etc | Arlon, Taconic, Isola, Panosonic, Rogers, ITEQ, 3M, Omega, Dupont, ,RTG5880,etc | Arlon, Taconic, Isola, Panosonic, Rogers, ITEQ, 3M, Omega, Dupont, ,RTG5880,etc |
| Minimum dielectric thickness | 0.1mm | 0.05mm | 0.05mm | 0.05mm |
| Layer count | 2-26 | 2-40 | 2-46 | 2-50 |
| HDI / Buried - blind via | Mechanical B/B via | Mechanical B/B via | Mechanical B/B via | Mechanical B/B via |
| Copper filled BVH (Y/N) | N | N | N | N |
| Copper filled PTH (Y/N) | N | N | N | N |
| Capped via (Y/N) | Y | Y | Y | Y |
| LDI (Y/N) | N | N | N | N |
| Maximum board size (mm) | 20*24inch | 22*52inch | 20*30inch | 20*35inch |
| Minimum board thickness (mm) | 0.3mm | 0.2mm | 0.2mm | 0.2mm |
| Maximum board thickness (mm) | 5.0mm | 10.0mm | 6.0mm | 6.0mm |
| Minimum track / gap IL (mil) | 3.5mil(1/2oz) | 3mil | 2mil | 2mil |
| Minimum track / gap OL (mil) | 4.0mil(1/2oz) | 3mil | 3mil | 2mil |
| Surface finish |
HAL, HASL LF, ENIG, Imm Silver, Imm Sn, OSP, Gold plating, ENIG+Gold finger,L/F HASL +Gold finger |
HAL, HASL LF, ENIG, Imm Silver, Imm Sn, OSP, Gold plating, ENIG+Gold finger,L/F HASL +Gold finger |
HAL, HASL LF, ENIG, Imm Silver, Imm Sn, OSP, Gold plating, ENIG+Gold finger,L/F HASL +Gold finger |
HAL, HASL LF, ENIG, Imm Silver, Imm Sn, OSP, Gold plating ,ENIG+Gold finger,L/F HASL +Gold finger |
| Layer to layer registration | 2mil | 1.5mil | 1.5mil | 1.5mil |
| Minimum hole (mech) (mm/mil) | 0.2mm | 0.2mm | 0.15mm | 0.15mm |
| Minimum hole (laser) (mm/mil) | 0.1mm | 0.1mm | 0.1mm | 0.1mm |
| Aspect ratio PTH | 12:1 | 14:1 | 16:1 | 16:1 |
| Aspect ration BVH | 0.5:1 | 0.5:1 | 0.5:1 | 0.5:1 |
| Finish hole tolerance (PTH) | +/-3mil | +/-3mil | +/-3mil | +/-3mil |
| Finish hole tolerance (NPTH) | +/-2mil | +/-2mil | +/-2mil | +/-2mil |
| Maximum Cu weight OL | 6oz | 10oz | 6oz | 6oz |
| Maximum Cu weight IL | 4oz | 6oz | 4oz | 4oz |
| Controlled impedance (+/- X%) | 10% | 5% | 10% | 10% |
| Capacity (SQM / month) | 6000 | 6000 | 8000 | 10000 |
| Rigid-flex (Y/N) | Y | Y | Y | Y |
| Flexible (Y/N) | Y | Y | Y | Y |
| IMS (Y/N) | Y (Al metel substrate) | Y (Al, copper metel substrate) | Y (Al, copper metel substrate) | Y (Al, copper metel substrate) |
| Embedded components (Y/N) | Y | N/A | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | Y | Y |